typical microstructure

The bond exhibited typical glass phase with low melting temperature and high bending strength of strips ( 53.62-93.34MPa). The microstructure analysis indicated the enhancement of the bonding strength resulted from the chemical reaction between the vitrified bond and microcrystal alumina ceramic.

结合剂为典型玻璃相，熔融温度较低，试样抗折强度为53.62-93.34MPa，微观分析表明两者间发生了化学反应，增强了结合剂对磨粒的把持力，提高了磨具的强度。

The solidification microstructure of the stainless steel layer was typical coarse cellular dendrite crystal epitaxially from the mother sheet, and after rolling it changes to the fine equiaxed crystal.

凝固层轧制前为逆热流方向外延生长的粗大胞状树枝晶，轧制后为细小的等轴晶组织。

The typical microstructure ( Q235): the surface layer is tempered sorbite; the transition layer is pearlite and ferrite, and the partial ferrite is acicular; the core is pearlite and ferrite and the grain fineness is 8~ 10 grade.

钢筋典型的金相组织（Q235）表层为回火索氏体，过渡层为珠光体+铁素体且部分铁素体呈针状，心部为珠光体+铁素体，晶粒度8～10级；

Carry on temperature cycle test on typical components, inspects solder joint crack in different cycle, observe microstructure of solder joint in virtue of metallographic analyse, study solder joint failure mode in temperature cycle and offer basis to improve technology parameter.

针对典型元器件进行温度循环试验，在不同的循环周期检查焊点的开裂情况，并采用金相分析观察焊点的显微组织，分析焊点在温度循环条件下的失效模式，为改进工艺参数提供依据。