sputtering etching

Reactive ion beam etching process is one of the ultrafine machining techniques which have been rapidly developed in recent years. Patterns on the working pieces are made by sputtering effects and chemical reaction which occur when reactive ion beam bombard the solid surface.

反应离子束刻蚀技术是近年来发展起来的一种微细加工技术，它利用反应离子束轰击团体表面时发生的溅射效应和化学反应剥离加工工作上的几何图形。

Make use of magnetron sputtering, evaporation, vacuum vapor deposition, laser etching to prepare continuous or not continuous metal films also caused most interesting of the scholar.

而利用磁控溅射、热蒸镀、电化学沉积等方法制备的连续或者非连续金属膜衬底在表面增强荧光效应中也得到了广泛的应用。

Calculation of Total Sputtering Yield and Etching Rate on Binary Compound

二元化合物总原子溅射率和刻蚀速率的经验公式